I-DyMN Series I-Thermal Imaging Core
Uchungechunge lwe-DyMN-640/384 oluwuchungechunge olungapholisiwe lokucabanga okushisayo lusebenzisa i-chip ye-infrared infrared processing chip enelungelo lobunikazi ukuze ithathele indawo yesixazululo se-FPGA yendabuko, futhi ibe nomtshina omusha wephakheji we-WLP owakhelwe wona ongu-12μm wamaphikseli we-WLP, ohlinzeka ngokusebenza kwedijithali okufanayo ukuze kuhlanganiswe kalula futhi. ukuthuthukiswa, futhi ingaxhunywa ngokuguquguqukayo kumapulatifomu ahlukahlukene okucubungula ahlakaniphile. Ngokusebenza okuphezulu, usayizi omncane, isisindo esincane, ukusetshenziswa kwamandla okuphansi kanye nentengo yezomnotho, ukuhlangabezana nezidingo zohlelo lokusebenza lwe-SWAP3 (Usayizi, Isisindo Namandla, Ukusebenza, Intengo).
| I-DyMN-640 | I-DyMN-384 | |
| Uhlobo lomtshina | I-Vox Engapholile | |
| Ububanzi be-Spectral | 8-14 um | |
| Ukulungiswa kwe-IR | 640×512 | 384×288 |
| I-Pixel | 12μm | |
| I-NETD | ≤50mK@25℃,F#1.0 (≤40mK ngokuzikhethela) | |
| I-FOV | 48.7°×38.6° | 29.2°×21.7° |
| Ilensi | 9.1mm F1.0 | |
| Izinga lokuvuselela | Isithombe: 50Hz/25Hz; lokushisa: 25Hz; | |
| Ukucutshungulwa kwesithombe | I-algorithm engeyona ye-TEC Ukulungiswa kokungafani Ukunciphisa umsindo wesihlungi sedijithali Ukuthuthukiswa kwemininingwane yedijithali | |
| Okukhipha isithombe | I-10bit/14bit (eyashintshwa) | |
| Gxila | Lungisa noma imanuwali | |
| Ibanga lokulinganisa | (-20℃~+150℃ ,0℃~+450℃) | |
| Ukunemba kokulinganisa | ±2℃ noma ±2% | |
| Imodi yokulinganisa | Iphoyinti, umugqa, ibhokisi | |
| Ukunikezwa kwamandla kagesi | 1.8V, 3.3V, 5V*2 | |
| Ukusetshenziswa@25℃ | ＜0.65W | ＜0.6W |
| Isithombe esibonakalayo | I-SPI/DVP | |
| Control interface | I-I2C | |
| Ubukhulu | 21mm×21mm | |
| Isisindo | 9 g | |
| Izinga lokushisa lokusebenza | (-40℃~+80℃ | |
| Izinga lokushisa lesitoreji | (-50℃~85℃ | |
| Ukwethuka | 80g@4ms | |
Bhala umyalezo wakho lapha futhi usithumelele wona
